New Equipment | Soldering Robots
The C-Base Bonding/Soldering system is a combination of a C-Flow and a C-Drive module and stands alone from other pulsed heat controllers with its unique integration of responsive temperature control and useful tools such as displacement monitoring a
Reliable optical inspection of wave, reflow, pre-reflow and selective soldering. More than an entry into AOI Optimal, ergonomic loading through large opening angle Superior resolution, reliable 01005 and fine-pitch inspection Scalable camera t
Industry News | 2022-12-14 12:21:04.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1841 at the 2023 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Jan. 24-26, 2023, at the San Diego Convention Center in California.
Industry News | 2014-04-22 14:31:18.0
MIRTEC announces that it will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7-504, at the SMT/Hybrid/Packaging 2014 exhibition, scheduled to take place May 6-8, 2014 in Nuremberg, Germany.
A Manufacturer of High Quality, Precision, Automated Fluid Dispensing and Conformal Coating Systems, SMT Cover Tape Peel Tester and Lead Forming machines for through-hole component preparation.
611 Hollingsworth Street
Grand Junction, CO USA
Phone: (970) 245-0408
